Multipurpose quick 3D packaging process

A novel small-sized chip circuit auxiliary layer (SCCAL) multipurpose 3D package process in order to solve the problem of shortages in flexibility and diversity of the traditional through-silicon via (TSV) process is presented in this paper. It meets the requirement of large amount of silicon dies w...

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Bibliographic Details
Published in2011 International Symposium on Advanced Packaging Materials (APM) pp. 287 - 290
Main Authors Zhao Yongrui, Ma Hongbo, Bi Minglu, Huang Zhanwu, Jia Jun, Lai Xinquan
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2011
Subjects
Copper
Joining processes
Packaging
Silicon
Three dimensional displays
Through-silicon vias
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Summary:A novel small-sized chip circuit auxiliary layer (SCCAL) multipurpose 3D package process in order to solve the problem of shortages in flexibility and diversity of the traditional through-silicon via (TSV) process is presented in this paper. It meets the requirement of large amount of silicon dies which need connecting together by TSV technology but were designed respectively that wafers were processed without via holes drilling. This process involves a small-sized chip circuit auxiliary layer which is used as a carrying base and connecting auxiliary layer. Also, an improved TSV technology is involved that via holes could be produced through the PADs in the silicon dies. It is verified that, the whole process time of 3D packaging process is shortened drastically and the flexibility of the 3D packaging is greatly improved.
ISBN:9781467301480
1467301485
ISSN:1550-5723
DOI:10.1109/ISAPM.2011.6105718