An exhaustive search of the 6C level crosstalk avoidance codes for TSV array

Through-silicon vias (TSVs) is one of the key enabling technologies of 3-D ICs. However, the crosstalk problem among the adjacent TSVs decreases the performance and deteriorates the signal integrity of TSV bus. This paper proposes an exhaustive search technique of 6C crosstalk avoidance codewords th...

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Bibliographic Details
Published in2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC) pp. 1 - 2
Main Authors Mengying Luo, Xiaole Cui, Qiujun Lin, Xiaoyan Xu, Yichi Luo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2017
Subjects
brute-force method
Capacitance
Conferences
Crosstalk
crosstalk avoidence
Delays
Search methods
Three-dimensional displays
Through-silicon vias
TSV
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Summary:Through-silicon vias (TSVs) is one of the key enabling technologies of 3-D ICs. However, the crosstalk problem among the adjacent TSVs decreases the performance and deteriorates the signal integrity of TSV bus. This paper proposes an exhaustive search technique of 6C crosstalk avoidance codewords that is applicable for TSV arrays of different sizes to suppress the crosstalk noise below 6C level. The proposed technique has lower system overhead than that of 3D 4-LAT and 6CmFNS methods.
DOI:10.1109/EDSSC.2017.8126413