Prediction of board level reliability of drop test for system-in-package

The drop reliability of mobile electronic products has become a major concern recently. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased the stress during drop impact due to their complicate structure. In this study, evaluation and prediction...

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Bibliographic Details
Published in2008 IEEE 9th VLSI Packaging Workshop of Japan pp. 53 - 56
Main Authors Yamada, E., Amagai, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2008
Subjects
Analytical models
Costs
Deformable models
Electronics packaging
Finite element methods
Material properties
Mobile handsets
Predictive models
Stress
System testing
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Summary:The drop reliability of mobile electronic products has become a major concern recently. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased the stress during drop impact due to their complicate structure. In this study, evaluation and prediction of the drop reliability for SIP was performed using modeling techniques. 3D-dynamic nonlinear finite element analysis was conducted for simulation of drop test, and a good correlation was observed between the simulation result and actual drop test. The optimization for material properties of the package was also studied using the correlation data and modeling.
ISBN:9781424434985
142443498X
ISSN:2373-5449
2475-8418
DOI:10.1109/VPWJ.2008.4762204