Phase change based thermal buffering of transient loads for power converter
This paper deals with the system design, technology and test of a novel concept of integrating silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The innovative power-electronics concept features do...
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Published in | 20th International Workshop on Thermal Investigations of ICs and Systems pp. 1 - 7 |
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Main Authors | , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | This paper deals with the system design, technology and test of a novel concept of integrating silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The innovative power-electronics concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. To avoid a cold plate at the backside, a new low-cost, low-footprint thermal storage device has been developed and optimized by simulation to meet the requirements given by this application. Coupled-field simulations are used to predict thermal performance and are being verified by especially designed test stands. |
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DOI: | 10.1109/THERMINIC.2014.6972516 |