Phase change based thermal buffering of transient loads for power converter

This paper deals with the system design, technology and test of a novel concept of integrating silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The innovative power-electronics concept features do...

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Bibliographic Details
Published in20th International Workshop on Thermal Investigations of ICs and Systems pp. 1 - 7
Main Authors Wunderle, B., Springborn, M., May, D., Mrossko, R., Ras, M. Abo, Manier, C.-A, Oppermann, H., Mitova, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2014
Subjects
Conferences
Copper
Heating
Phase change materials
Temperature measurement
Thermal conductivity
Transient analysis
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Summary:This paper deals with the system design, technology and test of a novel concept of integrating silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The innovative power-electronics concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. To avoid a cold plate at the backside, a new low-cost, low-footprint thermal storage device has been developed and optimized by simulation to meet the requirements given by this application. Coupled-field simulations are used to predict thermal performance and are being verified by especially designed test stands.
DOI:10.1109/THERMINIC.2014.6972516