IC package inspection with nanofocus X-ray tubes and nanoCT

Nanofocus tube technology in combination with high resolution CT are the driving forces in X-ray and the leading future technologies for the inspection of IC packages. The paper shows different results of highest resolution failure analysis performed with latest 2D and 3D nanofocus techniques like t...

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Bibliographic Details
Published in2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits pp. 1 - 3
Main Authors Roth, H., Zhenhui He, Paul, T.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2008
Subjects
Computed tomography
Detectors
Electron tubes
Image resolution
Inspection
Wires
X-ray imaging
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Summary:Nanofocus tube technology in combination with high resolution CT are the driving forces in X-ray and the leading future technologies for the inspection of IC packages. The paper shows different results of highest resolution failure analysis performed with latest 2D and 3D nanofocus techniques like the first 180 kV nanoCT system.
ISBN:9781424420391
1424420393
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2008.4588179