Surface-based finite element method for large-scale 3D circuit modeling

This paper presents a novel surface-based finite element method for full-wave modeling of large-scale 3D physical circuits. In contrast to traditional finite element methods that involve 3D volumetric unknowns, this method reduces the unknowns one needs to solve to those on 2D surface elements of in...

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Bibliographic Details
Published inIEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 pp. 347 - 350
Main Authors Jiao, D., Chakravarty, S., Changhong Dai, Shiuh-Wuu Lee
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Computational electromagnetics
Finite element methods
Flexible printed circuits
Integrated circuit interconnections
Large-scale systems
Maxwell equations
Microprocessors
Parameter extraction
Power system modeling
Sparse matrices
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Summary:This paper presents a novel surface-based finite element method for full-wave modeling of large-scale 3D physical circuits. In contrast to traditional finite element methods that involve 3D volumetric unknowns, this method reduces the unknowns one needs to solve to those on 2D surface elements of interest only. It preserves the advantages of the finite element method in circuit application such as the flexibility in modeling irregular geometry, the capability in handling arbitrary inhomogeneity, and the handling of sparse matrices. Meanwhile, it eliminates the disadvantages long associated with traditional finite element methods such as large memory requirement and high CPU cost resulted from 3D volumetric discretization. Experimental and numerical results are given to demonstrate its accuracy and computational efficiency.
ISBN:9780780392205
0780392205
ISSN:2165-4107
DOI:10.1109/EPEP.2005.1563777