Wafer level vacuum packaging for MEMS device by solder sealing

Wafer level vacuum packaging is an emerging method to offer a hermetic cavity for MEMS devices with the smaller size and the lower cost, and is expected to be a new generation packaging technology of mass production to substitute the traditional metallic packaging and ceramic packaging. Solder bondi...

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Bibliographic Details
Published in2011 12th International Conference on Electronic Packaging Technology and High Density Packaging pp. 1 - 4
Main Authors Bing An, Gan-ran Tang, Ya-nan Sun, Wei-wen Lu, Yi-ping Wu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2011
Subjects
Bonding
Cavity resonators
Micromechanical devices
Military standards
Ovens
Packaging
Vacuum technology
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Summary:Wafer level vacuum packaging is an emerging method to offer a hermetic cavity for MEMS devices with the smaller size and the lower cost, and is expected to be a new generation packaging technology of mass production to substitute the traditional metallic packaging and ceramic packaging. Solder bonding in a vacuum oven was employed in this work to achieve a Chip-to-Wafer (C2W) vacuum bonding for MEMS device. The results showed that the hermeticity of the samples met the requirements of MIL-STD-883. Effects of the process parameters such as the solder layer thickness, the soaking time of reflow, and the bonding pressure on bonding quality were investigated and optimized.
ISBN:1457717700
9781457717703
DOI:10.1109/ICEPT.2011.6066803