Life-time of lead-free soldered SMT joints

The work concern the life-time of electronic products according to ROHS Directive of European Community. Methods and results of accelerated mechanical and thermal cycling fatigue tests of SnPb and lead-free solder joints, realized in GreenRoSE EC Project are described. The aim of the work is develop...

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Bibliographic Details
Published in2008 31st International Spring Seminar on Electronics Technology pp. 17 - 21
Main Authors Szwech, M., Drozd, Z.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2008
Subjects
Costs
Electric shock
Electronic equipment
Electronic equipment testing
Environmentally friendly manufacturing techniques
Fatigue
Lead
Life estimation
Soldering
Surface-mount technology
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Summary:The work concern the life-time of electronic products according to ROHS Directive of European Community. Methods and results of accelerated mechanical and thermal cycling fatigue tests of SnPb and lead-free solder joints, realized in GreenRoSE EC Project are described. The aim of the work is development of cheap test methods, applicable by small producers of electronic equipment. Thermal shock cycling method and mechanical method of cycling bending of PCB samples with soldered SMT and BGA components were applied. The investigations showed the possibility of simplified reliability assessment of lead-free electronic products by mechanical fatigue testing. Advantage of this method is lower cost and shorter test time as by thermal cycling. The planes of further research for obtaining more detailed data are discussed.
ISBN:1424439728
1424439736
9781424439720
9781424439737
ISSN:2161-2528
DOI:10.1109/ISSE.2008.5276493