Enabling flexible datacenter interconnect networks with WDM silicon photonics

Datacenters are creating an unprecedented challenge for optical transceivers requiring multiple high performance lasers, modulators and photodiodes in a single module to meet growing bandwidth needs along with dramatically lower power and cost reflecting the higher volume and density of interconnect...

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Bibliographic Details
Published inProceedings of the IEEE 2014 Custom Integrated Circuits Conference pp. 1 - 6
Main Authors Fish, Gregory A., Sparacin, Daniel K.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2014
Subjects
Bandwidth
Diode lasers
Indium phosphide
Integrated circuit interconnections
Modulation
Optical Interconnections
Photonics
Semiconductor laser arrays
Semiconductor optical amplifiers
Semiconductor waveguides
Servers
Silicon photonics
Wafer scale integration
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Summary:Datacenters are creating an unprecedented challenge for optical transceivers requiring multiple high performance lasers, modulators and photodiodes in a single module to meet growing bandwidth needs along with dramatically lower power and cost reflecting the higher volume and density of interconnections. The heterogeneous integration of InP material into a silicon photonics wafer flow enables high performance integrated circuits to be fabricated using established silicon foundry infrastructure. Aurrion has established a library of photonic circuit elements which can be combined to form the single chip solutions for products like 100Gb/s transceivers needed for current and next generation datacenter applications.
ISSN:0886-5930
2152-3630
DOI:10.1109/CICC.2014.6946048