A modeling of soldering adhesion forecast for the crystalline silicon solar cell

• Published in: Conference record of the IEEE Photovoltaic Specialists Conference pp. 2004 - 2006
• Main Authors: Wen-Tai Chung, Wei-Cyun Lee, Chi-Kun Wu, Yu-Ting Hung, Chien-Wen Chen
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.06.2014
• Subjects: Adhesion; Adhesives; Bus bar; Microscopy; Numerical models; Optical imaging; Optical microscopy; Reliability; Ribbon; Semiconductor device modeling; Silicon; Solar cell

The soldering process is an important research subject for photovoltaic application. The soldering adhesion is a critical factor to module reliabilities. In this study, it discloses a non-destroyed method for soldering adhesion forecast of crystalline silicon solar cells. Combine the soldering adhes...