A modeling of soldering adhesion forecast for the crystalline silicon solar cell

The soldering process is an important research subject for photovoltaic application. The soldering adhesion is a critical factor to module reliabilities. In this study, it discloses a non-destroyed method for soldering adhesion forecast of crystalline silicon solar cells. Combine the soldering adhes...

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Bibliographic Details
Published inConference record of the IEEE Photovoltaic Specialists Conference pp. 2004 - 2006
Main Authors Wen-Tai Chung, Wei-Cyun Lee, Chi-Kun Wu, Yu-Ting Hung, Chien-Wen Chen
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2014
Subjects
Adhesion
Adhesives
Bus bar
Microscopy
Numerical models
Optical imaging
Optical microscopy
Reliability
Ribbon
Semiconductor device modeling
Silicon
Solar cell
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Summary:The soldering process is an important research subject for photovoltaic application. The soldering adhesion is a critical factor to module reliabilities. In this study, it discloses a non-destroyed method for soldering adhesion forecast of crystalline silicon solar cells. Combine the soldering adhesion test, the bus bar surface roughness measures and a numerical method to develop a numerical model. It could quickly calculate the soldering adhesion, analysis the screen-printing performance and judge the root cause of the soldering failure. The adhesion simulation result is in agreement with the experiment. The error is less 3% between the simulation and the experiment.
ISSN:0160-8371
DOI:10.1109/PVSC.2014.6925319