Most efficient alternative as a way of sub-80 nm contact holes and trenches formation

In this paper, we compared three processes to confirm their feasibility and extract the weak and strong aspects of each process. Each process was evaluated with a mask having 1:1 square array and the isolated contact hole patterns of various contact CD and pitches and then its appropriate or best la...

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Published inDigest of Papers Microprocesses and Nanotechnology 2003. 2003 International Microprocesses and Nanotechnology Conference pp. 14 - 15
Main Authors Jung Hwan Hah, Jin-Young Yoon, Hata Mitsuhiro, Hyun-Woo Kim, Sang-Gyun Woo, Han-Ku Cho, Woo-Sung Han
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Chemical processes
Chemical technology
Electronics industry
Lithography
Page description languages
Research and development
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Summary:In this paper, we compared three processes to confirm their feasibility and extract the weak and strong aspects of each process. Each process was evaluated with a mask having 1:1 square array and the isolated contact hole patterns of various contact CD and pitches and then its appropriate or best layout was determined or recommended for real device application.
ISBN:4891140402
9784891140403
DOI:10.1109/IMNC.2003.1268495