Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding

A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is...

Full description

Saved in:
Bibliographic Details
Published in2007 International Conference on Control, Automation and Systems pp. 2804 - 2807
Main Authors Soo Il Lee, Sang Hyuk Hong
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2007
Subjects
Online AccessGet full text

Cover

Loading…
Abstract A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.
AbstractList A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.
Author Soo Il Lee
Sang Hyuk Hong
Author_xml – sequence: 1
  surname: Soo Il Lee
  fullname: Soo Il Lee
  organization: Univ. of Seoul, Seoul
– sequence: 2
  surname: Sang Hyuk Hong
  fullname: Sang Hyuk Hong
BookMark eNotz7tOwzAUgGEjwUALLwCLXyDhOHYuHquIS0UFA92r4xs9kmtHTkDq2zPQ6d8-6V-x65STZ-xBQC0E6KftOG6-6gagr5WCblDdFVsNWrcAcujkLXv_yClS8lj4L5mCC-XEMWE8zzTzHPhPXArOOZHlx1wSP2XnIw-58BBpquyRJm5ycpS-79hNwDj7-0vXbP_yvB_fqt3n63bc7CrSsFTotQ7BGhM0YgOIwuvWewnQ9FIK4yRiL3BA5axt0WLQQihljepcF5SVa_b4z5L3_jAVOmE5Hy578g_AkkwV
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/ICCAS.2007.4406846
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEEE Electronic Library Online
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library Online
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EISBN 8995003863
9788995003862
EndPage 2807
ExternalDocumentID 4406846
Genre orig-research
GroupedDBID 6IE
6IL
CBEJK
RIE
RIL
ID FETCH-LOGICAL-i90t-ae99ffcbbf9aa20aa1e95ee30027331bd3aa71a8a4dcc5acaf91144cb46d6f4c3
IEDL.DBID RIE
IngestDate Thu Jun 29 18:24:33 EDT 2023
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i90t-ae99ffcbbf9aa20aa1e95ee30027331bd3aa71a8a4dcc5acaf91144cb46d6f4c3
PageCount 4
ParticipantIDs ieee_primary_4406846
PublicationCentury 2000
PublicationDate 2007-Oct.
PublicationDateYYYYMMDD 2007-10-01
PublicationDate_xml – month: 10
  year: 2007
  text: 2007-Oct.
PublicationDecade 2000
PublicationTitle 2007 International Conference on Control, Automation and Systems
PublicationTitleAbbrev ICCAS
PublicationYear 2007
Publisher IEEE
Publisher_xml – name: IEEE
Score 1.4207445
Snippet A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a...
SourceID ieee
SourceType Publisher
StartPage 2804
SubjectTerms Aerodynamics
Bonding processes
Electronic mail
Finite element methods
Flip-chip bonding
Frequency
Mathematical model
MATLAB
Nonlinear analysis
Nonlinear equations
Shape
Ultrasonic horn
Vibrations
Title Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding
URI https://ieeexplore.ieee.org/document/4406846
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3NS8MwFA_bTp5UNvGbHDzaLW2SdjnKcEzFIThht_HyxYajHV3rwb_eNO0migdvIQkkvJD3y8f7_R5CN8Bj6prCIOIqCdhQhG5LSecMNQdKpAlD7QNkp_HkjT3O-byFbvdcGGOMDz4z_aro__J1psrqqWzAHPo4vGyjdiJEzdXa8WCIGDyMRnevtShh0_FHxhQPGOND9Lwbqo4Tee-Xheyrz18qjP-dyxHqfVPz8MsedI5Ry6Rd9DStBS8gxx_V9bcyNoZGbgRnFpfrIodtpYKLl1meYp__BrvzKrbr1SZQy9UGy8wTXHpoNr6fjSZBkyUhWAlSBGCEsFZJaQVARABCI7gx1AvV0FBqCpCEMASmleKgwDr3xpiSLNaxZYqeoE6apeYU4ZhrGxGhIm4tSwjIJDZkqI227mybWHqGupUdFptaB2PRmOD87-oLdODfQX3g2yXqFHlprhyAF_Lar9wXQsCf5g
link.rule.ids 310,311,783,787,792,793,799,27937,55086
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LSwMxEA61HvSk0opvc_DotvtIdjdHKZbWPhCs0FuZvGix7JZ114O_3mx2W1E8eAtJIGFC8k2S-b5B6A5oGJgmz_GpiBwSM89sKW4OQ0khcLnyPGkDZKfh4JU8zem8ge53XBillA0-U52yaP_yZSqK8qmsSwz6GLzcQ_vGr47Diq21ZcK4rDvs9R5eKlnCuuuPnCkWMvpHaLIdrIoUeesUOe-Iz186jP-dzTFqf5Pz8PMOdk5QQyUtNJpWkheQ4Y_yAlyaG0MtOIJTjYt1nsF7qYOLl2mWYJsBBxuPFev1auOI5WqDeWopLm006z_OegOnzpPgrJibO6AY01pwrhmA7wJ4ilGlAitVE3hcBgCRBzEQKQQFAdoccIQITkIZaiKCU9RM0kSdIRxSqX2XCZ9qTSIXeBQqN5ZKauPdRjo4R63SDotNpYSxqE1w8Xf1LToYzCbjxXg4HV2iQ_sqasPgrlAzzwp1beA85zd2Fb8AyrWjMQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2007+International+Conference+on+Control%2C+Automation+and+Systems&rft.atitle=Nonlinear+vibration+analysis+of+ultrasonic+horn+model+for+flip-chip+bonding&rft.au=Soo+Il+Lee&rft.au=Sang+Hyuk+Hong&rft.date=2007-10-01&rft.pub=IEEE&rft.spage=2804&rft.epage=2807&rft_id=info:doi/10.1109%2FICCAS.2007.4406846&rft.externalDocID=4406846