Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding

A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is...

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Bibliographic Details
Published in2007 International Conference on Control, Automation and Systems pp. 2804 - 2807
Main Authors Soo Il Lee, Sang Hyuk Hong
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2007
Subjects
Aerodynamics
Bonding processes
Electronic mail
Finite element methods
Flip-chip bonding
Frequency
Mathematical model
MATLAB
Nonlinear analysis
Nonlinear equations
Shape
Ultrasonic horn
Vibrations
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Summary:A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.
DOI:10.1109/ICCAS.2007.4406846