A Systematic Semi-Numerical Approach for Modeling of Signal and Power Integrity of Electronic Packages

A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment...

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Bibliographic Details
Published in2007 IEEE International Symposium on Electromagnetic Compatibility pp. 1 - 6
Main Authors Er-Ping Li, En-Xiao Liu, Zaw Zaw Oo, Xingchang Wei, Yaojiang Zhang, Vahldieck, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2007
Subjects
Electronics packaging
Equivalent circuits
Matrix converters
Moment methods
Nonhomogeneous media
Power system modeling
Power systems
Semiconductor device packaging
Signal analysis
Substrates
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Summary:A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment method and the scattering matrix method.
ISBN:1424413494
9781424413492
ISSN:2158-110X
2158-1118
DOI:10.1109/ISEMC.2007.188