Analysis of stress and strain distribution on pad during bump bonding process

The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain di...

Full description

Saved in:
Bibliographic Details
Published in2014 15th International Conference on Electronic Packaging Technology pp. 219 - 222
Main Authors Tang Wenliang, Huang Chunyue, Li Tianming, Liang Ying, Xiong Guoji, Wu Song, Li Chunquan, Ning Zhongping
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2014
Subjects
Bonding
bump bonding
Educational institutions
Finite element analysis
Load modeling
pad
Strain
Stress
Ultrasonic imaging
Online AccessGet full text

Cover

More Information
Summary:The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain distribution of the pad is not even and increasing with the time, the largest stress and strain all locate the bonding edge, meanwhile, the small stress and strain all locate the bonding centre and basically remain unchanged in the bonding process, a stress and strain gradient from the bonding centre to the bonding edge appear in the pad. The distribution of stress and strain of pad is reflected from the bump bonding conditions.
DOI:10.1109/ICEPT.2014.6922640