Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation

Thermal crosstalk within a heterogeneous 3D IC results in higher temperatures for low-power dice; this is particularly true in memory-logic, photonic-logic, and MEMS-logic stacks. The elevated temperatures may consequently impact the performance of the low-power devices. This paper describes a therm...

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Bibliographic Details
Published in2014 International 3D Systems Integration Conference (3DIC) pp. 1 - 5
Main Authors Yang Zhang, Sarvey, Thomas E., Bakir, Muhannad S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2014
Subjects
3D IC
Bridges
Couplings
DRAM
Heat sinks
microbumps
microfluidic heat sink (MFHS)
multicore processor
Temperature sensors
Thermal resistance
Three-dimensional displays
Through-silicon vias
TSVs
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Summary:Thermal crosstalk within a heterogeneous 3D IC results in higher temperatures for low-power dice; this is particularly true in memory-logic, photonic-logic, and MEMS-logic stacks. The elevated temperatures may consequently impact the performance of the low-power devices. This paper describes a thermal solution for both heat removal as well as thermal isolation within a 3D chip stack. Based on the evaluated memory-logic 3D architecture and compared to conventional air-cooling, the proposed technologies reduce the maximum temperature of the memory die from 75.6 °C to 36.7 °C and processor die from 75.9 °C to 60.1 °C.
DOI:10.1109/3DIC.2014.7152174