Fluxless reflow of eutectic solder bump using formic acid

This work elucidates the solder reflow of eutectic (63Sn/37Pb) solder bump using fluxless formic acid. The dependences of formic acid reflow on metallic oxide reduction are investigated experimentally for eutectic solder bump. Appropriate temperature profile and sufficient formic acid concentration...

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Bibliographic Details
Published inProceedings of the 2009 12th International Symposium on Integrated Circuits pp. 514 - 517
Main Authors Yong-Shan Lin, Chun-Hsing Shih, Wei Chang
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2009
Subjects
Charge carriers
Charge measurement
Circuits
Current measurement
Electron beams
eutectic solder bump
flip chip package
fluxless reflow
formic acid
Probes
Radiative recombination
Scanning electron microscopy
Semiconductor materials
Spontaneous emission
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Summary:This work elucidates the solder reflow of eutectic (63Sn/37Pb) solder bump using fluxless formic acid. The dependences of formic acid reflow on metallic oxide reduction are investigated experimentally for eutectic solder bump. Appropriate temperature profile and sufficient formic acid concentration are the key factors to optimize the metallic oxide reduction during thermal reflow. A positive pressure in process chamber is beneficial to control the variations of unwanted oxygen and the regrowth of metallic oxide during mechanical wafer switching. A reflowed solder joint degrades considerably under shear strength testing after several reflow times.
ISBN:9810824688
9789810824686
ISSN:2325-0631