Improvement of transconductance and gate source capacitance of Al0.27Ga0.73N/GaN HEMT at 45nm gate length with In0.1Ga0.9N back-barrier
An Al 0.27 Ga 0.73 N/GaN HEMT is developed at L G =100nm gate length with In 0.1 Ga 0.9 N back-barrier. The physical insight of In 0.1 Ga 0.9 N as back-barrier and the impact of its height on transconductance are investigated to find the optimized dimension of the device with improved transconductan...
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Published in | 2017 Devices for Integrated Circuit (DevIC) pp. 131 - 135 |
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Main Authors | , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.03.2017
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Subjects | |
Online Access | Get full text |
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Summary: | An Al 0.27 Ga 0.73 N/GaN HEMT is developed at L G =100nm gate length with In 0.1 Ga 0.9 N back-barrier. The physical insight of In 0.1 Ga 0.9 N as back-barrier and the impact of its height on transconductance are investigated to find the optimized dimension of the device with improved transconductance, g m , at 45nm gate length. Non-linearity like Kink Effect is also identified. Some initial level of ac analysis is done to obtain the C GS plot with varying gate lengths. With necessary simulations, 33% improvement in peak gm and 26.3% reduction in Cgs are obtained. |
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DOI: | 10.1109/DEVIC.2017.8073921 |