TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration

3D integration development has to be driven by industrial demand and applications. To get interested in those technological developments, industrials shall be convinced by benefits of Through Silicon Vias (TSV) integration versus traditional assembly approach. This will demonstrate that this approac...

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Bibliographic Details
Published in3rd Electronics System Integration Technology Conference ESTC pp. 1 - 4
Main Authors Druais, G, Ancey, P, Chapelon, L L, Charbonnier, J, Cheramy, S, Dodo, Y, Farcy, A, Garnier, G, Guillou, Y, Henry, D, Leduc, P, Pruvost, J, Saugier, E, Sillon, N
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2010
Subjects
CMOS integrated circuits
CMOS technology
Copper
Industries
Micromechanical devices
Photonics
Through-silicon vias
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Summary:3D integration development has to be driven by industrial demand and applications. To get interested in those technological developments, industrials shall be convinced by benefits of Through Silicon Vias (TSV) integration versus traditional assembly approach. This will demonstrate that this approach is worth being more developed and implemented. In this study, we demonstrated that we are able to achieve similar performance for a given product using a standard wire bonding packaging and an integration with TSV. Both electrical measurements on test structures and characterization on product are compared.
ISBN:9781424485536
1424485533
DOI:10.1109/ESTC.2010.5642920