Temperature-limited microprocessors: Measurements and design implications

The details of the power distribution of state of the art CMOS chips (e.g., local regions of high power (or hotspots), which disproportionally drive up junction temperatures) can have a severe impact on reliability, manufacturing yield and chip performances. In this paper we discuss the results of a...

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Bibliographic Details
Published in20th International Conference on VLSI Design held jointly with 6th International Conference on Embedded Systems (VLSID'07) pp. 427 - 432
Main Authors Hamann, H.F., Weger, A., Lacey, J., Zhigang Hu, Bose, P., Cohen, E., Wakil, J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2007
Subjects
Drives
Energy management
Manufacturing
Microprocessors
Power distribution
Power measurement
Semiconductor device measurement
Temperature distribution
Temperature measurement
Thermal management
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Summary:The details of the power distribution of state of the art CMOS chips (e.g., local regions of high power (or hotspots), which disproportionally drive up junction temperatures) can have a severe impact on reliability, manufacturing yield and chip performances. In this paper we discuss the results of a recently developed technique (spatially-resolved imaging of microprocessor power (SIMP)), which can measure power and temperature distributions of high power chips (e.g., microprocessors) under full operating conditions. Specifically, we present detailed microprocessor power distributions for different workloads with and without power/thermal management. The data yields a more comprehensive understanding of the relationships between hotspots and the respective designs, layouts, floorplans, micro-architectures and thermal/power management schemes, which is discussed in detail
ISBN:0769527620
9780769527628
ISSN:1063-9667
2380-6923
DOI:10.1109/VLSID.2007.154