High-sensitivity micro-magnetic probe for the applications of safety and security

This paper presents a high-resolution near-field magnetic sensing system for nondestructive inspection applications of safety and security. The system includes a probe chip based on a 0.18-μm 5-metal-layer CMOS process technology and a micro-position calibration mechanism. The probe chip includes a...

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Bibliographic Details
Published in2017 7th International Conference on Integrated Circuits, Design, and Verification (ICDV) pp. 10 - 15
Main Authors Nguyen Ngoc Mai-Khanh, Iizuka, Tetsuya, Nakajima, Shigeru, Asada, Kunihiro
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2017
Subjects
analysis
Calibration
CMOS
failure
fault detection
Field programmable gate arrays
Gain
integrated circuit
magnetic
Magnetic circuits
Magnetic devices
pick-up coil
power device
probe
Probes
security
sensor
Sensors
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Summary:This paper presents a high-resolution near-field magnetic sensing system for nondestructive inspection applications of safety and security. The system includes a probe chip based on a 0.18-μm 5-metal-layer CMOS process technology and a micro-position calibration mechanism. The probe chip includes a magnetic pick-up coil followed by a 3-stage low-noise amplifier to amplify the induced voltage on the coil. A mechanical scanning system with an ability of micro-position calibration is to allow high-precision calibration and micro-scanning operation. For the security application, a high spacial resolution magnetic scanning experiment is conducted on a micro-strip line and on the surface of a cryptographic FPGA running 128-bit Advanced Encryption Standard algorithm. In addition, the magnetic probe is used for safety applications for fault detection in both low-power devices and power electric circuits.
DOI:10.1109/ICDV.2017.8188628