Thermal design and analysis of high power LED with LTCC packaging

Two enhanced high power LED thermal structures with LTCC (Low Temperature Cofired Ceramics) packaging are presented. At first, these two types of structures are introduced respectively in details. One is called structure GPC (Gold-plated Copper) and the other is called structure SPA (Silver-plated A...

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Bibliographic Details
Published in2012 13th International Conference on Electronic Packaging Technology & High Density Packaging pp. 845 - 848
Main Authors Yang Hai, Daoguo Yang, Dejin Yan, Wanchun Tian
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2012
Subjects
Abstracts
Educational institutions
Heating
Light emitting diodes
Packaging
Reliability
Thermal conductivity
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Summary:Two enhanced high power LED thermal structures with LTCC (Low Temperature Cofired Ceramics) packaging are presented. At first, these two types of structures are introduced respectively in details. One is called structure GPC (Gold-plated Copper) and the other is called structure SPA (Silver-plated Aluminum). Later, thermal analyses are made by CFD software and the calculated-junction-temperature will be considered an important judgment for these two LEDs thermal performance. Meanwhile, results are compared and there thermal performances are analyzed. At last, a suggestion of high power LED with LTCC packages is presented. This work may provide some basis for High power LED with LTCC packaging on thermal design and analysis.
ISBN:9781467316828
1467316822
DOI:10.1109/ICEPT-HDP.2012.6474742