Electroplating apparatus and method considerations for high aspect-ratio through-hole copper electroplating process

• Published in: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference pp. 1 - 3
• Main Authors: Ming-Yao Yen, Yuk-Nam Hung, Kwok-Wai Yee, Hsien-Chang Chen, Hsin-Sen Liang, Lefebvre, Mark
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.10.2010
• Subjects: Anodes; Cathodes; Cities and towns; Copper; Materials; System-on-a-chip; Vibrations
• ISBN: 1424497833; 9781424497836
• ISSN: 2150-5934; 2150-5942
• DOI: 10.1109/IMPACT.2010.5699473

As the electronic products become multi-functional and complicated, relatively high-density pattern must be designed to meet these requirements. As a result, multilayer printed circuit boards (PCBs) with high aspect ratio (AR>;13) through hole metallization become the main trend in fabrication. That is, how to metalize the PCBs by Copper deposit with high throwing power and reliability becomes a major research. In this topic, a batch system of electroplating equipment designed for the use in the pilot line for acid Copper plating are discussed. It is included a comparison of distance between anodes, anode and cathode, different types of solution agitation, such as air, paddle, and cathode vibration. According to the study results, the throwing power for plate-through hole and microvia plating and deposition distribution could be improved by the adjustment of anode distance (anode/anode or anode/cathode), solution agitation (both air and paddle), and rock vibration, of cathode during plating.