Study on detection method of small-size solder ball defects

In order to solve defect detection problem of small-size solder ball in the high density chip, the method based on the pulsed eddy current thermal imaging technology (ECPT) was put forward to study the solder ball defects. With establishing 3D induction heating finite element model, the defects such...

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Bibliographic Details
Published in2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM) pp. 213 - 217
Main Authors Xiuyun Zhou, Yaqiu Chen, Xiaochuan Lu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.11.2017
Subjects
defect detection
Eddy currents
Heating systems
Imaging
infrared thermal imaging
pulsed eddy current thermal imaging
solder ball
Soldering
Surface cracks
Temperature distribution
Thermal conductivity
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Summary:In order to solve defect detection problem of small-size solder ball in the high density chip, the method based on the pulsed eddy current thermal imaging technology (ECPT) was put forward to study the solder ball defects. With establishing 3D induction heating finite element model, the defects such as cracks, voids can be distinguished by comparing the different temperature field. Furthermore, the experiments with solder balls of different defects and various crack size are carried out. Both experiment result and simulation study verify the reliability and convenience of ECPT method.
ISBN:9781538635056
1538635054
DOI:10.1109/ICAM.2017.8242171