Single chip RF front-end MMIC solutions for future low cost, miniature size, WLAN transceiver module applications

Several highly integrated RF front-end modules (FEMs) for 802.11 b/g and a/b/g applications are described. In a single 4/spl times/4 mm or 5/spl times/5 mm QFN package, these FEMs include linearized power amplifier(s), a low-noise amplifier, T/R diversity switch, filters, diplexers, power detectors,...

Full description

Saved in:
Bibliographic Details
Published in2005 Asia-Pacific Microwave Conference Proceedings Vol. 5; p. 4 pp.
Main Authors Yuen, C., Laursen, K., Adams, M., Due Chu, Hai Nguyen
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Costs
CSP
DVB-H
GaAs HBT
GaAs MMIC
GaAs PHEMT
GPS
Low-noise amplifiers
LTCC
MMICs
Packaging
PDA
QFN
Radio frequency
Radiofrequency amplifiers
RF Front-End Module (FEM)
Switches
Switching circuits
Transceivers
Wireless LAN
WLAN
Online AccessGet full text

Cover

More Information
Summary:Several highly integrated RF front-end modules (FEMs) for 802.11 b/g and a/b/g applications are described. In a single 4/spl times/4 mm or 5/spl times/5 mm QFN package, these FEMs include linearized power amplifier(s), a low-noise amplifier, T/R diversity switch, filters, diplexers, power detectors, and all biasing and matching circuitry. The RF FEMs replace over 30 discrete and IC components with a single package, and require practically no external components. They have the smallest footprint of any 802.11 FEM on the market and allow significant cost savings at the system level by reducing parts count, simplifying assembly, and increasing yield.
ISBN:078039433X
9780780394339
ISSN:2165-4727
2165-4743
DOI:10.1109/APMC.2005.1606972