Evolution of Cu Electro-Deposition Technologies for 45nm and Beyond

As device geometry continues to diminish, the requirement of reliable copper metallization of narrow geometries becomes very challenging. The physical, electrical, reliability and manufacturability aspects of Cu electro-deposition (ECD) require full characterization for future generations. This pape...

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Bibliographic Details
Published in2006 International Interconnect Technology Conference pp. 175 - 177
Main Author Shue, W.S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2006
Subjects
Atherosclerosis
Character generation
Chemicals
Copper
Filling
Geometry
Manufacturing processes
Metallization
Nanoscale devices
Tides
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Summary:As device geometry continues to diminish, the requirement of reliable copper metallization of narrow geometries becomes very challenging. The physical, electrical, reliability and manufacturability aspects of Cu electro-deposition (ECD) require full characterization for future generations. This paper will address the key challenges of ECD modules and several some possible solutions through proper optimizations of ECD process. The extendibility of ECD beyond 45 nm-node technologies was discussed
ISBN:1424401046
9781424401048
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2006.1648680