Design and simulation of a macro-micro dual-drive high acceleration precision XY-stage for IC bonding technology

• Published in: 2005 6th International Conference on Electronic Packaging Technology pp. 161 - 165
• Main Authors: Degang Jie, Lining Sun, Yanjie Liu, Yuhong Zhu, Hegao Cai
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2005
• Subjects: Acceleration; Analytical models; Bonding; Coils; Frequency; Microactuators; Micromotors; Optimization methods; Output feedback; Position measurement
• ISBN: 9780780394490; 0780394496
• DOI: 10.1109/ICEPT.2005.1564689

A macro-micro dual-drive high acceleration precision XY-stage is presented in this paper. Combining macro with micro actuator, a system of large workspace and high acceleration with high resolution of motion is developed. Two linear voice coil motors (VCM) are used into the macro motion, and two PZT-driven micro stages of high frequency are mounted on each motor to compensate the position error. A novel elastic decoupling mechanism is used in the stage to avoid the moving gap. The high resolution linear encoder is integrated into the closed-loop feedback, which is used to measure the position of the output end of macro stage and micro stage. By using the mechanical dynamic simulation and FEA method, the decoupling mechanism and the micro mechanism are optimized, and the dynamic characteristics of the high acceleration stage are investigated, which is based on the rigid-flexible dynamic analysis of mechanical system. The simulation results show that this new configuration allows a workspace of 25/spl times/25mm/sup 2/ and an acceleration exceeding 100m/s/sup 2/ with a resolution of motion better than 10nm. The significantly improved performance of the XY-stage can meet the requirement of the rapid development of IC bonding technology.