Feature extraction and damage-precursors for prognostication of lead-free electronics

• Published in: 56th Electronic Components and Technology Conference 2006 p. 10 pp.
• Main Authors: Pradeep Lall, Madhura Hande, Chandan Bhat, Nokibul Islam, Suhling, J., Lee, J.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2006
• Subjects: Electronic packaging thermal management; Electronics packaging; Environmental management; Environmentally friendly manufacturing techniques; Feature extraction; History; Plastics; Testing; Thermal degradation; Thermal stresses
• ISBN: 1424401526; 9781424401529
• ISSN: 0569-5503
• DOI: 10.1109/ECTC.2006.1645736

Damage pre-cursors based health management and prognostication methodology has been presented for electronic systems in harsh environments. The framework has been developed based on a development of correlation between damage pre-cursors and underlying degradation mechanisms in lead-free packaging architectures. The proposed methodology eliminates the need for knowledge of prior stress histories and enables interrogation of system state using the identified damage pre-cursors. Test vehicle includes various area-array packaging architectures subjected to single thermo-mechanical stresses including thermal cycling in the range of -40degC to 125degC and isothermal aging at 125degC. Experimental data on damage pre-cursors has been presented for packaging architectures encompassing flex-substrate ball grid arrays, chip-array ball grid arrays, and plastic ball grid arrays. Examples of damage proxies include, phase-growth parameter, intermetallic thickness and interfacial stress variations. Damage proxies have correlated with residual life. The damage proxies have also been correlated with computational finite-element model predictions. Plastic and creep strain energy densities have been correlated to the identified damage proxies