Packaging technology of power module for automotive applications

The number of in-vehicle power devices has been increasingly for motor controlling purposes. Power device packages should ideally be small and easy to mount. We have developed a small power module by assembling several power devices sealed with molding resin. Two new techniques were used to produce...

Full description

Saved in:
Bibliographic Details
Published in2017 International Conference on Electronics Packaging (ICEP) pp. 117 - 121
Main Authors Shimozuma, Ayako, Hayashi, Hiromasa, Higuchi, Shingo, Sakamoto, Yoshitsugu, Okada, Sakie
Format Conference Proceeding
LanguageEnglish
Published Japan Institute of Electronics Packaging 01.04.2017
Subjects
Copper
copper clip
Fatigue
Lead
mechanical integration
MOSFET
Multichip modules
power module
Soldering
Strain
Online AccessGet full text

Cover

More Information
Summary:The number of in-vehicle power devices has been increasingly for motor controlling purposes. Power device packages should ideally be small and easy to mount. We have developed a small power module by assembling several power devices sealed with molding resin. Two new techniques were used to produce this module: one was the use of copper clips for high-current wiring, and the other was low-cost soldering using residue-free solder paste. This paper describes the features of the structure that uses copper clips, a soldering technique and process employing a newly developed soldering material, and the reliability of solder joints implemented with this material.
DOI:10.23919/ICEP.2017.7939337