Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages

The main aim for development of small electronic packages is supported by an ongoing development of portable communications devices. Thin silicon dies are believed to improve as device performance as its reliability. Additionally, novel packaging techniques as stacked packaging reduce packaging cost...

Full description

Saved in:
Bibliographic Details
Published in2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 pp. 1 - 7
Main Authors Dowhan, L., Wymyslowski, A., Dudek, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2007
Subjects
Constraint optimization
Consumer electronics
Design optimization
Electronic packaging thermal management
Electronics packaging
Input variables
Materials reliability
Microelectronics
Numerical models
Optimization methods
Online AccessGet full text

Cover

More Information
Summary:The main aim for development of small electronic packages is supported by an ongoing development of portable communications devices. Thin silicon dies are believed to improve as device performance as its reliability. Additionally, novel packaging techniques as stacked packaging reduce packaging cost, size, improve functionality and reliability. In case of the stacked packages, wafers are stacked to form 3D multi-chip package. On the other hand, the electronic market requires novel and efficient numerical designing tools to deal properly with the optimization. The goal of the current work was to design a reliable numerical model of the stacked package and afterwards perform numerical multi-objective optimization in reference to a number of variables, which influence the stacked package reliability.
ISBN:142441105X
9781424411054
DOI:10.1109/ESIME.2007.359963