Synthesis of Thermal Compound and Its Application as a Thermal Interface Material of Power Module

The development and growth of highly integrated semiconductors is being used for high-performance mobile phones, large-capacity computer servers, and Artificial Intelligence for high-speed computation processing. This technology development requires advanced technology of basic semiconductor packagi...

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Bibliographic Details
Published in2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) pp. 482 - 486
Main Authors Seonja, Song, Changkook, Jang, Kyeongho, Shin, Juhyung, Kim, Youngseok, Kim, Jaeuk, Chu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2018
Subjects
Aluminum oxide
Composite materials
Conductivity
Heat transfer
Heating systems
Nanocomposites
SiC Power Module
Thermal Compound
Thermal Interface Material
TIM
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Summary:The development and growth of highly integrated semiconductors is being used for high-performance mobile phones, large-capacity computer servers, and Artificial Intelligence for high-speed computation processing. This technology development requires advanced technology of basic semiconductor packaging. In realizing such technology, thermal analysis and development of excellent heat dissipation materials are very essential for the use of products. We have developed a heat dissipation compound using a high thermal material such as Al 2 O 3 and ZnO and reliable polymer resins. We also confirmed the theoretical foundation of the heattransfer effect by computer simulation and applied it to the model of the SiC power module in Electric/Hybrid Electric Vehicle to see its efficiency improve.
ISSN:2577-0799
DOI:10.1109/ITHERM.2018.8419467