Improved performance of high power single emitter semiconductor diode laser by new submount

The package material and structure critically influence the major characteristics of semiconductor laser diodes, such as thermal behavior, output power, electrical-to-optical efficiency and reliability. We have designed and fabricated the new submount package for high power semiconductor diode laser...

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Bibliographic Details
Published in2018 International Conference on Electronics, Information, and Communication (ICEIC) pp. 1 - 2
Main Authors Lim, Jungwoon, Jang, Hyungsik, Hann, Swook
Format Conference Proceeding
LanguageEnglish
Published Institute of Electronics and Information Engineers 01.01.2018
Subjects
Aluminum nitride
chip on submount
Diode lasers
high power diode laser
III-V semiconductor materials
Optical device fabrication
optical package
Power lasers
Reliability
Semiconductor lasers
single emitter
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Summary:The package material and structure critically influence the major characteristics of semiconductor laser diodes, such as thermal behavior, output power, electrical-to-optical efficiency and reliability. We have designed and fabricated the new submount package for high power semiconductor diode laser module, which was called direct bonded copper (DBC). It was found that the new submount-based module has 15% higher power and higher efficiency than that of the traditional aluminium nitride (AN) submount, due to the high thermal conductivity.
DOI:10.23919/ELINFOCOM.2018.8330682