Inspection of miniaturised interconnections in IC packages with nanofocus X-ray tubes and nanoCT

Nanofocus tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus techniques are briefly outlined and typical results of highest resolution failure analysis including bond wire defects, copper bond...

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Bibliographic Details
Published in2009 International Conference on Electronic Packaging Technology & High Density Packaging pp. 996 - 1001
Main Authors Zhenhui He, Quan Wen, Xiaojie Huang
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2009
Subjects
Bonding
Computed tomography
Copper
Failure analysis
Flip chip
Image resolution
Inspection
Integrated circuit packaging
Wire
X-ray imaging
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Summary:Nanofocus tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus techniques are briefly outlined and typical results of highest resolution failure analysis including bond wire defects, copper bond wire inspection, flip chip solder interconnection and microvia inspection are presented.
ISBN:9781424446582
1424446589
DOI:10.1109/ICEPT.2009.5270572