Design of experimental liquid heat sink for high power electronic

This article deals with issue of fluid heat sinks for power electronics. In the introduction there are listed different kinds of heat sinks depending on the complexity of heat sink structure. From this split the group of fluid heat sinks is selected. Chapter of cooling media is based on this chapter...

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Bibliographic Details
Published in2014 14th International Conference on Environment and Electrical Engineering pp. 392 - 396
Main Authors Sprlak, Roman, Opluštil, Josef, Kalvar, Daniel, Chlebis, Petr
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2014
Subjects
cooling medium
Corrosion
experimental designe
Fluids
frequency converter
heat sink
Heat sinks
Heating
IGBT module
Insulated gate bipolar transistors
Media
thermal field
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Summary:This article deals with issue of fluid heat sinks for power electronics. In the introduction there are listed different kinds of heat sinks depending on the complexity of heat sink structure. From this split the group of fluid heat sinks is selected. Chapter of cooling media is based on this chapter. The proposal of special liquid heat sink has been implemented from previous chapters. This heat sink is designed to create turbulent flow of fluid in cooling duct. The thermal simulations are subsequently carried out in this heat sink. Individual simulations are conducted for constant power loss. The simulation of one part of the heat sink is carried out and the whole simulation of heat sink with 3 capacity modules consisting of six IGBT transistors is conducted. Further the simulations of currently accessible fluid heat sinks WP16 and KL494 are provided. All results of simulations are shown in tables.
DOI:10.1109/EEEIC.2014.6835900