A New Approach for the Evaluation of Interfacial Reliability in Micro-scale

Lead-free solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. Th...

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Bibliographic Details
Published in2007 8th International Conference on Electronic Packaging Technology pp. 1 - 3
Main Authors Qingsheng Zhu, Zhefeng Zhang, Jianku Shang, Zhongguang Wang
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2007
Subjects
Aging
Copper
Crystal microstructure
Electronics packaging
Environmentally friendly manufacturing techniques
Fatigue
Lead
Materials science and technology
Soldering
Testing
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Summary:Lead-free solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. The types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the damage modes of the IMC interface, the interfacial reliability can be well evaluated in micro-scale.
ISBN:1424413915
9781424413911
DOI:10.1109/ICEPT.2007.4441515