High thermal performance ICP die attach process design and development for LQFP-EP

Many semiconductor devices require very high thermal performance, especially the automotive industry. Die attach material selection is a critical segment for achieving high thermal performance and stringent reliability requirements. The stringent reliability requirement at high temperature and long...

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Bibliographic Details
Published in2011 IEEE 13th Electronics Packaging Technology Conference pp. 190 - 194
Main Authors Lim Fui Yee, Khoo Ly Hoon, Tiu Kong Bee, Yow Kai Yun
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2011
Subjects
Curing
Delamination
Iterative closest point algorithm
Microassembly
Reliability
Resins
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Summary:Many semiconductor devices require very high thermal performance, especially the automotive industry. Die attach material selection is a critical segment for achieving high thermal performance and stringent reliability requirements. The stringent reliability requirement at high temperature and long operating hour test is needed to test the robustness of the device and its package. Typically, solder interconnect is a more suitable candidate to meet the high temperature and long test cycle. While it is known that a metal to metal connection is sustainable at high temperatures, for certain packages, design limitations and cost advantages are the driving forces for development of epoxy type die attach materials.
ISBN:9781457719837
1457719835
DOI:10.1109/EPTC.2011.6184413