Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique

Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on micro-scale and nano-scale. The presented project foc...

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Published inEuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems pp. 1 - 7
Main Authors Wymyslowski, Artur, Wittler, O., Mrossko, R., Dudek, Rainer, Auersperg, Juergen, Dowhan, Lukasz
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2009
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Summary:Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on micro-scale and nano-scale. The presented project focuses on application of the nanoindentation technique in order to extract the basic elastic and elasto-plastic mechanical properties of aluminium through analytical and numerical approaches. The results allowed to select the most appropriate elastoplastic material model that would be capable of fitting the experimental and numerical results. According to the performed analysis it was concluded that Ramberg-Osgood model fulfil the above criteria and can be used to predict the nanoindentation results in case of very thin aluminium layers.
ISBN:1424441609
9781424441600
1424441595
9781424441594
DOI:10.1109/ESIME.2009.4938422