Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination

• Published in: 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) pp. 308 - 311
• Main Authors: Meier, R. C., Badilita, V., Wallrabe, U., Korvink, J. G.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.03.2012
• Subjects: dry-resist lamination; Fabrication; Glass; Microfluidics; multi-level fluidic network; Resists; Substrates
• ISBN: 1467311227; 9781467311229
• DOI: 10.1109/NEMS.2012.6196781

In this work we present a new manufacturing method for MEMS based multi-level microfluidic devices. The combination of spin-coating SU-8 (MicroChem) and lamination of PerMX dry-photoresist (DuPont) enables the fabrication of a complex 3-level microfluidic channel network with channel aspect ratios ranging from 0.3 up to 3. On 13 mm 2 fluidic chip area we realized a complex 3D fluidic network by interconnecting three individual fluidic levels. The unique use of UV-photolithography tools and high-precision UV-lasering for the fluidic chip manufacturing results in 25 μm alignment accuracy between the fluidic levels. We further report on the high material compatibility of SU-8 and PerMX which results in high substrate adhesion of the fluidic devices (26.5 MPa).