Filter integration in ultra thin organic substrate via 3D stitched capacitor

This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2 dB, return loss of greater than 15 dB at 2.4 GHz and attenuation of greater than 30 dB below 2....

Full description

Saved in:
Bibliographic Details
Published in2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) pp. 1 - 4
Main Authors Sunghwan Min, Seunghyun Hwang, Daehyun Chung, Swaminathan, M., Sridharan, V., Chan, H., Fuhan Liu, Sundaram, V., Tummala, R.R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2009
Subjects
Capacitors
Dielectric materials
Dielectric substrates
Electronics packaging
Filters
Magnetic materials
Radio frequency
Semiconductor device packaging
Temperature
Wireless communication
Online AccessGet full text

Cover

More Information
Summary:This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2 dB, return loss of greater than 15 dB at 2.4 GHz and attenuation of greater than 30 dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2 mm × 3.0 mm × 0.2 mm (1.2 mm 3 ) in ultra thin organic RXP substrate.
ISBN:142445350X
9781424453504
ISSN:2151-1225
2151-1233
DOI:10.1109/EDAPS.2009.5404004