Thermal characterization of light-emitting sources of Cree types

Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree types is performed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is est...

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Published in2013 IEEE 12th International Conference on Laser and Fiber-Optical Networks Modeling (LFNM 2013) pp. 79 - 81
Main Authors Vaskou, A. S., Kononenko, V. K., Niss, V. S., Zakgeim, A. L., Chernyakov, A. E.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2013
Subjects
Ceramics
Electrical resistance measurement
Heating
Light emitting diodes
Thermal analysis
Thermal resistance
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Summary:Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree types is performed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is established. The value of LED active junction area is evaluated too.
DOI:10.1109/LFNM.2013.6644842