Microwave module packaging

The demonstration of a 50 package for GaAs MMIC (monolithic microwave integrated circuit) microwave module applications has not been achieved yet. The authors outline the requirements for microwave packaging and describe three low-cost metal-package solutions: (1) brazed construction, (2) metal inje...

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Bibliographic Details
Published in1992 IEEE MTT-S Microwave Symposium Digest pp. 1503 - 1506 vol.3
Main Authors Jerinic, G., Borkowski, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1992
Subjects
Assembly
Conducting materials
Costs
Electromagnetic heating
Electronic packaging thermal management
Gallium arsenide
Microwave devices
MMICs
Temperature
Thermal conductivity
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Summary:The demonstration of a 50 package for GaAs MMIC (monolithic microwave integrated circuit) microwave module applications has not been achieved yet. The authors outline the requirements for microwave packaging and describe three low-cost metal-package solutions: (1) brazed construction, (2) metal injection molded construction, and (3) pressure infiltration casting. It is concluded that housing costs that are less than 50 for large quantities can be achieved. If minimum weight is not an essential requirement, a 10-20% cost savings appears to be possible.< >
ISBN:9780780306110
0780306112
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.1992.188298