Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

• Published in: 2006 15th ieee international symposium on the applications of ferroelectrics pp. 9 - 16
• Main Authors: Klee, M., Beelen, D., Keur, W., Kiewitt, R., Kumar, B., Mauczok, R., Reimann, K., Renders, C., Roest, A., Roozeboom, F., Steeneken, P., Tiggelman, M., Vanhelmont, F., Wunnicke, O., Lok, P., Neumann, K., Fraser, J., Schmitz, G.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.07.2006
• Subjects: Cost function; dielectric; Dielectric devices; Dielectric thin films; ferroelectric; Ferroelectric materials; Mobile communication; Passive filters; Piezoelectric films; piezoelectric thin films; Radio frequency; Switches; System in Package; Thin film devices; thin film ultrasonic transducers
• ISBN: 1424413311; 9781424413317
• ISSN: 1099-4734; 2375-0448
• DOI: 10.1109/ISAF.2006.4387821

Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable system-in-package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.