Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC)

We present in this paper a new modified version of the System-in-Package (SiP) model based on three-layer chips. The idea is to add copper layers permitting to take up its thermal dissipation and to investigate the thermal performance we have used Finite Element Method (FEM) analyses with COMSOL Mul...

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Bibliographic Details
Published in2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM) pp. 1 - 5
Main Authors Oukaira, Aziz, Said, Dhaou, Zbitou, Jamal, Lakhssassi, Ahmed
Format Conference Proceeding
LanguageEnglish
Published IEEE 03.01.2023
Subjects
Analytical models
Chip-Cooling-Laminate-Chip (CCLC)
FEM
Heating systems
Packaging
SiP
System-in-package
Temperature distribution
Thermal conductivity
Thermal management
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Summary:We present in this paper a new modified version of the System-in-Package (SiP) model based on three-layer chips. The idea is to add copper layers permitting to take up its thermal dissipation and to investigate the thermal performance we have used Finite Element Method (FEM) analyses with COMSOL Multiphysics®. The temperature variation in the numerical simulation shows that the maximum temperature value is decreasing with a flat temperature distribution compared to the traditional model. Moreover, in terms of the thermal conduction performance, the thermal management of the system packaging, Chip-Cooling-Laminate-Chip (CCLC) is achieving high reliability and resolution with low-cost micro-devices especially for the micro-medicine applications, when the temperature maximum in the chips is reduced by 64%.
DOI:10.1109/IMCOM56909.2023.10035652