Interfacing silicon photonics for CPO

We report the development of high-yield and scalable optical coupling interfaces for CPO. Two concepts are discussed, a polymer waveguide based optical redistribution layer, and a micro-lens based free-space coupling interface. We detail both design, fabrication, assembly and characterization result...

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Bibliographic Details
Published in2024 IEEE 74th Electronic Components and Technology Conference (ECTC) pp. 1161 - 1165
Main Authors Van Steenberge, G., Van Asch, J., Geudens, V., De Baere, T., De Moerlooze, N., Missinne, J., Podpod, A., Lepage, G., Golshani, N., Magdziak, R., Sar, H., Bipul, S., Bode, D., Ban, Y., Ferraro, F., van Campenhout, J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 28.05.2024
Subjects
co-packaged optics
Costs
Couplings
Integrated optics
micro-optics
Optical coupling
Optical design
Optical device fabrication
optical redistribution layer
photonics packaging
scalable
Throughput
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Summary:We report the development of high-yield and scalable optical coupling interfaces for CPO. Two concepts are discussed, a polymer waveguide based optical redistribution layer, and a micro-lens based free-space coupling interface. We detail both design, fabrication, assembly and characterization results, and provide a discussion on the applicability for CPO.
ISSN:2377-5726
DOI:10.1109/ECTC51529.2024.00187