Investigation of Additional Elements in Sn-Bi Based Low-Temperature Solder

In order to minimize the energy consumption and thermal warpage during reflow process, low-temperature solder have become a hot research area in recent years. In this study, Sn-Bi system was chosen as the starting point for the study of low-temperature solders. By increasing the proportion of Sn and...

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Bibliographic Details
Published in2024 International Conference on Electronics Packaging (ICEP) pp. 203 - 204
Main Authors Chang, F. L., Chen, Y. C., Lin, Y. H., Wu, P. K., Chuang, M. C., Kao, C. R.
Format Conference Proceeding
LanguageEnglish
Published Japan Institute of Electronics Packaging 17.04.2024
Subjects
Aging
Electronic packaging thermal management
Electronics packaging
Energy consumption
Interfacial reaction
Low-temperature solder
Mechanical factors
Microstructure
Sn-Bi solder
Wettability
Zinc
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Summary:In order to minimize the energy consumption and thermal warpage during reflow process, low-temperature solder have become a hot research area in recent years. In this study, Sn-Bi system was chosen as the starting point for the study of low-temperature solders. By increasing the proportion of Sn and adding additional elements in Sn-Bi solder, it was expected that the melting point will be lowered and the mechanical properties will be improved at the same time. Then, influence of Sb addition on Sn-Bi solder grain refinement before and after thermal aging was investigated. Finally, several properties of different additional elements, including melting point, interfacial reaction, wettability and microstructure evolution were investigated.
DOI:10.23919/ICEP61562.2024.10535667