Moving Towards Microchannel-based Chip Cooling

Results of a review of the cooling needs for high performance computing (HPC) processors using advanced packaging indicates benefits of implementing direct cooling through silicon microchannels. Progress in fabrication of silicon microchannels, both in microcooler/cold plate and in direct cooling of...

Full description

Saved in:
Bibliographic Details
Published in2024 IEEE 74th Electronic Components and Technology Conference (ECTC) pp. 408 - 414
Main Authors Semenza, Paul, Thomas, Dave, Oakes, Garrett, Kirsch, Dave, Hang, Yin, Yee, Kuo-Chung, Cumbie, Michael, Benning, Paul, Iyengar, Madhusudan, Cao, Lihong, Chen, William, Samadi, Gity
Format Conference Proceeding
LanguageEnglish
Published IEEE 28.05.2024
Subjects
advanced packaging
Cooling
direct cooling
Electronic components
Fabrication
High performance computing
microchannels
Packaging
Program processors
Reviews
Online AccessGet full text

Cover

More Information
Summary:Results of a review of the cooling needs for high performance computing (HPC) processors using advanced packaging indicates benefits of implementing direct cooling through silicon microchannels. Progress in fabrication of silicon microchannels, both in microcooler/cold plate and in direct cooling of the die is assessed. Challenges in transferring silicon microchannels into HPC packaging are summarized, and steps towards commercialization are presented.
ISSN:2377-5726
DOI:10.1109/ECTC51529.2024.00072