Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure

In this paper, we introduce a new organic dielectric redistributed line (RDL) fabrication method by using hybrid bonding (LTHBI) technology integrated on glass panel level process (PLP). This technology is based on creating a low-layer-count and fine-pitch RDL structure via the semi-additive process...

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Bibliographic Details
Published in2024 IEEE 74th Electronic Components and Technology Conference (ECTC) pp. 1896 - 1899
Main Authors Hsiung, Chien-Kang, Wang, Terry, Wozny, Sarah, Bernt, Marvin L, Chen, Kuan-Nang
Format Conference Proceeding
LanguageEnglish
Published IEEE 28.05.2024
Subjects
Bonding
Dielectrics
Electronic components
Glass
HBI
Low Temperature Cu-Cu Bonding
PLP
RDL
Stress
Temperature measurement
Temperature sensors
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Summary:In this paper, we introduce a new organic dielectric redistributed line (RDL) fabrication method by using hybrid bonding (LTHBI) technology integrated on glass panel level process (PLP). This technology is based on creating a low-layer-count and fine-pitch RDL structure via the semi-additive process (SAP) on separated panel glass carriers. Then a higher-layer-count RDL can be subsequently assembled by using a hybrid bonding process at less than 200°C. For the novel process flow, we called it as "Hyper RDL®" or HRDL®. The utilization of low-temperature hybrid bonding for the RDL introduces a substantial reduction in accumulated stress during the process, thereby mitigating issues related to warpage.
ISSN:2377-5726
DOI:10.1109/ECTC51529.2024.00320