Curvilinear Mask Process Correction - status quo and outlook

Due to the increasing availability of Multi Beam Mask Writers (MBMW) and the associated wafer lithography benefits, efficient handling of curvilinear mask shapes in the post tape-out flow becomes increasingly important. The presence of complex curvilinear mask shapes generated by Inverse Lithography...

Full description

Saved in:
Bibliographic Details
Published in2022 International Workshop on Advanced Patterning Solutions (IWAPS) pp. 1 - 7
Main Authors Bork, Ingo, Mishra, Kushlendra, Sharma, Rachit, Zuo, Mary
Format Conference Proceeding
LanguageEnglish
Published IEEE 21.10.2022
Subjects
Compaction
Conferences
curvilinear
ILT
Inspection
Lithography
Mask Data Preparation
Mask Process Correction
MPC
photomask
Shape
Online AccessGet full text

Cover

More Information
Summary:Due to the increasing availability of Multi Beam Mask Writers (MBMW) and the associated wafer lithography benefits, efficient handling of curvilinear mask shapes in the post tape-out flow becomes increasingly important. The presence of complex curvilinear mask shapes generated by Inverse Lithography Technology (ILT), or similar techniques requires new features and algorithms, especially in the context of applying Mask Process Correction (MPC). This paper discusses the status of Curvilinear Mask Process Correction (CLMPC) and gives a brief outlook into the near future of handling curvilinear mask shapes in the post tape-out flow. A summary of MRC requirements for incoming data and implications for mask inspection are included as well to put CLMPC into the right context. Further, approaches for CLMPC file size compaction along with new methods of data representation based on native curve formats are also discussed.
DOI:10.1109/IWAPS57146.2022.9972290