Enhanced Thermal and Electrical Properties of Functionalized h-BN/Epoxy Resin Composites

Hexagonal boron nitride nanosheet (h-BN) is widely applied to polymer-based nanocomposites due to its good thermal and insulation properties. Moreover, surface modification can contribute to improving dispersity and compatibility of nanofillers in polymer-based nanocomposites. Epoxy resin (EP) nanoc...

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Bibliographic Details
Published in2021 IEEE 4th International Electrical and Energy Conference (CIEEC) pp. 1 - 5
Main Authors Li, Jiacai, Niu, Huan, Li, Mingru, Li, Shengtao, Liu, Ye, Mao, Hangyin
Format Conference Proceeding
LanguageEnglish
Published IEEE 28.05.2021
Subjects
Boron
Conductivity
Conferences
Electric breakdown
Epoxy resins
Insulation
Nanocomposites
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Summary:Hexagonal boron nitride nanosheet (h-BN) is widely applied to polymer-based nanocomposites due to its good thermal and insulation properties. Moreover, surface modification can contribute to improving dispersity and compatibility of nanofillers in polymer-based nanocomposites. Epoxy resin (EP) nanocomposites filled with functionalized h-BN can further improve its thermal and insulating properties. In this work, a novel surface modification method of grafting dopamine (DA) at the end of 3-glycidoxypropyl-trimethoxysilane (KH560) is proposed to modify h-BN (DKB) as well as DKB and its corresponding EP nanocomposites are prepared successfully. The dispersibility of EP composites filled with h-BN is firstly discussed. Besides, the thermal performance and breakdown field strength of EP nanocomposites filled with modified h-BN are mainly investigated. The results show that surface modification method of DKB can effectively enhance the dispersity and compatibility of h-BN in the EP polymer. The thermal stability and thermal conductivity of DKB/EP nanocomposites has significant improvement. Meanwhile, breakdown field strength of DKB/EP nanocomposites is also superior to that of other h-BN/EP nanocomposites.
DOI:10.1109/CIEEC50170.2021.9510331